Critical signal routing
Plan controlled, practical interconnect for high-speed digital, differential, clock, memory, and converter signals.
Engineering capability
High-Speed PCB Design
Board-level engineering for digital systems where interfaces, power, layout, controlled routing, and manufacturability must work together.
Problems we solve
Focused engineering for the points where projects get stuck
Engage LTL for one defined technical problem or for coordinated delivery across the complete scope.
Power and component decisions
Coordinate power distribution, component selection, decoupling, sequencing, protection, and availability constraints.
Dense system integration
Fit FPGA, processor, converter, connector, and peripheral requirements into one manufacturable board architecture.
Manufacturing readiness
Prepare controlled fabrication, assembly, BOM, test, and early-unit support deliverables.
What you receive
Engineering deliverables prepared for continuation
The exact release package follows the agreed scope, with source files, evidence, instructions, and revision records included where applicable.
- ✓Schematics and design review records
- ✓Altium Designer source files
- ✓PCB layout and fabrication outputs
- ✓Gerbers, drill files, and assembly data
- ✓BOM and component-alternative review
- ✓Bring-up, test, and revision documentation
Technical scope
Practical capabilities
Work is organized around defined technical milestones and adapted to the target platform, available evidence, and project stage.
- ✓Digital board architecture
- ✓High-speed and differential interfaces
- ✓Controlled-impedance routing
- ✓Power distribution
- ✓Component selection
- ✓Schematic development
- ✓PCB layout
- ✓Design review
- ✓DFM and DFA review
- ✓Manufacturing preparation
Example applications
Where this capability fits
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FPGA carrier boards
◎
High-speed converter boards
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Interface adapters
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Sensor readout
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Industrial control electronics
◎
Laboratory equipment
Engagement options
From one work package to complete delivery
Start at the stage where specialist support creates the most value, without forcing an unnecessary full-project scope.
Architecture and feasibility
Review interfaces, components, mechanics, power, risk, and manufacturability before capture begins.
Schematic or layout package
Deliver a focused board-design stage or complete the missing portion of an existing design.
Independent design review
Assess an existing schematic, layout, BOM, or manufacturing package and document findings.
Board-to-bring-up delivery
Develop the design, prepare production data, and support prototype assembly and validation.
Development process
A defined sequence from requirements to release
- 01
Capture electrical and mechanical constraints
- 02
Develop the schematic architecture
- 03
Review critical interfaces and power
- 04
Complete placement and routing
- 05
Prepare and review manufacturing files
Repeatable delivery
Engineering quality from design through handover
Written technical control, design review, versioned development, verification, documented release, and post-delivery support.
Read the quality framework ↗Related verified work
FPGA-Based High-Speed ADC Acquisition Platform
An end-to-end data-acquisition platform that receives all eight serial-LVDS outputs from an AD9222 evaluation board, reconstructs 12-bit samples in FPGA logic, and moves captured data through embedded Linux to a host computer over Ethernet.
- 8
- simultaneous ADC channels
- 12-bit
- reconstructed sample width
- 65 MSPS
- validated per channel
Related hardware
Boards and adapters
LTL-ADA-101
HSMC to Tyco Adapter
Connects HSMC-equipped FPGA development boards to the AD9222 evaluation board for high-speed LVDS data acquisition.
View details ↗LTL-ADA-103GPIO to FMC Adapter
Connects GPIO interfaces to FMC-compatible FPGA systems, with support for DE2-115 and DE10 development platforms and 50 Ω impedance-matched routing.
View details ↗LTL-ADA-104GPIO to Parallel Edge
GPIO-to-parallel-edge adapter supporting DC1620, 50 Ω impedance-matched routing, and data transfer rates up to 4.2 Gbps.
View details ↗Engineering inquiry